Supply of Semiconductor Dicing and Grinding Systems
A Contract Award Notice
by SWANSEA UNIVERSITY
- Source
- Find a Tender
- Type
- Contract (Goods)
- Duration
- not specified
- Value
- £104K-£279K
- Sector
- INDUSTRIAL
- Published
- 08 Nov 2021
- Delivery
- not specified
- Deadline
- n/a
Related Terms
Location
to be delivered to Swansea University Bay Campus or Newport Wafer Fab (to be determined prior to delivery)
1 buyer
- Swansea University Swansea
1 supplier
- Disco Hi Tec Crawley
Description
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. This requirement is split into two separate lots
Lot Division
| 1 | Wafer Dicing System Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK. |
| 2 | Wafer Grinding System This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK. |
Award Detail
| 1 | Disco Hi Tec (Crawley)
|
| 2 | Disco Hi Tec (Crawley)
|
Award Criteria
| Technical | 70 |
| price | 30 |
CPV Codes
- 38000000 - Laboratory, optical and precision equipments (excl. glasses)
Other Information
** PREVIEW NOTICE, please check Find a Tender for full details. ** (WA Ref:115452)
Reference
- ocds-h6vhtk-02cb8f
- FTS 027974-2021