Die Bonding System

Location

Description

Funding is available to purchase a die attach/bonding system capable of performing a wide range of bonding processes, including ultrasonic, flip-chip, and UV curing, which is suitable for prototyping and light production runs. As a result, a crucial aspect for any die attach system under is the ability to be used for bonding runs as small as a single die should this be required. This stipulation lends itself to a semi-automated (i.e. motorised) system, ideally with the capacity to store process recipes to maximise reproducibility should the system be used for light production runs.

CPV Codes

• 38000000 - Laboratory, optical and precision equipments (excl. glasses)

Indicators

• Contract is suitable for SMEs.

Other Information

Link to eSourcing Portal https://tenders.bris.ac.uk